H10W 20/4405
The principal metal being aluminium
Official title: {the principal metal being aluminium}
H10W20/4405 (The principal metal being aluminium) appears on 793 US grants and 747 published applications in this corpus.
Search patents in H10W- Granted patents
- 793
- Published applications
- 747
- Assignees
- 203
- Inventors
- 1,452
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 6 | 0 |
| 1995 | 10 | 0 |
| 1996 | 12 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 15 | 0 |
| 2000 | 12 | 0 |
| 2001 | 18 | 5 |
| 2002 | 14 | 16 |
| 2003 | 12 | 7 |
| 2004 | 14 | 10 |
| 2005 | 10 | 7 |
| 2006 | 4 | 5 |
| 2007 | 11 | 11 |
| 2008 | 6 | 7 |
| 2009 | 4 | 19 |
| 2010 | 9 | 13 |
| 2011 | 11 | 16 |
| 2012 | 7 | 12 |
| 2013 | 13 | 15 |
| 2014 | 26 | 38 |
| 2015 | 31 | 46 |
| 2016 | 53 | 69 |
| 2017 | 76 | 80 |
| 2018 | 71 | 57 |
| 2019 | 57 | 61 |
| 2020 | 55 | 42 |
| 2021 | 40 | 51 |
| 2022 | 27 | 32 |
| 2023 | 39 | 40 |
| 2024 | 31 | 32 |
| 2025 | 20 | 35 |
| 2026 | 18 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor structure and manufacturing method thereof29 Sep 2026US 12,751,258 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure and electronic device including the same29 Sep 2026US 12,751,281 B2Samsung Electronics Co., Ltd.
- Gate contact structure8 Sep 2026US 12,733,469 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing the same25 Aug 2026US 12,721,141 B2Renesas Electronics Corporation
- Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging11 Aug 2026US 12,707,976 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Contact window, memory unit, and memory device and fabrication method thereof24 Sep 2026US 2026/0293650 A1Semiconductor Manufacturing Beijing Corporation
- Composition, method of preparing fine pattern by using the same, and method of manufacturing semiconductor device by using the same17 Sep 2026US 2026/0275125 A1Samsung Electronics Co., Ltd.
- Semiconductor device and preparation method therefor, and memory and electronic device17 Sep 2026US 2026/0282342 A1Beijing Superstring Academy of Memory Technology
- Metal film and manufacturing method of the metal film, and semiconductor device and method of manufacturing the semiconductor device20 Aug 2026US 2026/0247685 A1Renesas Electronics Corporation
- Method for producing interconnections25 Jun 2026US 2026/0182355 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Method for maximizing air gap in back end of the line interconnect through via landing modification318US 9,837,355 B2International Business Machines Corporation · 2017
- Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections290US 5,739,579 AIntel Corporation · 1998
- Flat metal features for microelectronics applications161US 10,840,135 B2Invensas Corporation · 2020
- Method for forming multileves interconnections for semiconductor fabrication153US 5,817,572 AIntel Corporation · 1998
- Method for fabrication of a semiconductor device and structure105US 8,058,137 B1Monolithic 3D Inc. · 2011