H10W 20/217
Comprising ring-shaped isolation structures outside of the via holes
Official title: {comprising ring-shaped isolation structures outside of the via holes}
H10W20/217 (Comprising ring-shaped isolation structures outside of the via holes) appears on 469 US grants and 570 published applications in this corpus.
Search patents in H10W- Granted patents
- 469
- Published applications
- 570
- Assignees
- 136
- Inventors
- 701
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 3 | 2 |
| 2003 | 1 | 4 |
| 2004 | 4 | 3 |
| 2005 | 1 | 10 |
| 2006 | 1 | 27 |
| 2007 | 7 | 18 |
| 2008 | 5 | 21 |
| 2009 | 15 | 32 |
| 2010 | 23 | 37 |
| 2011 | 46 | 43 |
| 2012 | 29 | 60 |
| 2013 | 38 | 48 |
| 2014 | 50 | 35 |
| 2015 | 46 | 32 |
| 2016 | 44 | 23 |
| 2017 | 23 | 21 |
| 2018 | 23 | 18 |
| 2019 | 18 | 17 |
| 2020 | 19 | 24 |
| 2021 | 14 | 19 |
| 2022 | 17 | 23 |
| 2023 | 17 | 11 |
| 2024 | 15 | 14 |
| 2025 | 7 | 14 |
| 2026 | 2 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solid-state image sensor, and electronic device24 Mar 2026US 12,588,479 B2Sony Semiconductor Solutions Corporation
- Semiconductor device including a memory stack and a contact structure in a spacer structure6 Jan 2026US 12,519,038 B2Yangtze Memory Technologies Co., Ltd.
- Solid-state imaging device having through electrode provided therein and electronic apparatus incorporating the solid-state imaging device30 Dec 2025US 12,514,020 B2Sony Group Corporation
- Testing structure for an integrated chip having a high-voltage device25 Nov 2025US 12,482,698 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Structure with air gaps extending from dielectric liner around through semicondcutor via21 Oct 2025US 12,451,411 B2GLOBALFOUNDRIES U. S. Inc.
- Dual Guard Ring Design for Through Via17 Sep 2026US 2026/0282871 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device30 Jul 2026US 2026/0223420 A1Micron Technology, Inc.
- Semiconductor structure and method for forming the same16 Jul 2026US 2026/0206575 A1Powerchip Semiconductor Manufacturing Corporation
- Semiconductor device and method for forming the same9 Jul 2026US 2026/0198280 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure, manufacturing method therefor, and electronic device25 Jun 2026US 2026/0182322 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- System-in packages334US 8,503,186 B2Megica Corporation · 2013
- Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same244US 7,525,186 B2Hynix Semiconductor Inc. · 2009
- Chip spanning connection192US 7,521,806 B22009
- Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation127US 5,767,578 ASiliconix Incorporated · 1998
- Integrated circuit chip using top post-passivation technology and bottom structure technology110US 8,456,856 B2Megica Corporation · 2013