Semiconductor structure, manufacturing method therefor, and electronic device

A manufacturing method for a semiconductor structure, comprising:

• forming a dielectric layer on a substrate, wherein the dielectric layer comprises a conductive pattern, and the conductive pattern indicates a position at which a conductive pillar is formed in the substrate;
• and
• preparing the conductive pillar in the substrate based on the position, indicated by the conductive pattern, at which the conductive pillar is formed in the substrate, and electrically connecting the conductive pillar to an electronic component on the dielectric layer, wherein
• the conductive pillar is formed in a via that passes through the dielectric layer and the substrate in a first direction;
• the via comprises a first portion formed within the substrate;
• a part of an inner wall that is of the first portion and that is close to the dielectric layer is covered by a protective layer;
• and the first direction is a direction from the dielectric layer to the substrate.