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US 7,525,186 B2Granted
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same
AssigneeHynix Semiconductor Inc.
InventorsSung Min Kim, Min Suk Suh
Life of this patent
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Abstract
A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.
Claims5
A stack package comprising:
- a substantially planar substrate, having an upper and a lower surface;
- at least two semiconductor chips stacked on top of each other on the upper surface of the substrate, at least one of the semiconductor chips having a through-via interconnection plug and a guard ring, wherein the guard ring surrounds and electrically insulates the through-via interconnection plug;
- the semiconductor chips being electrically coupled to each other by the through-via interconnection plug;
- an over-mold material, which encapsulates at least part of the substrate and the stacked semiconductor chips;
- and
- a solder ball mounted to a lower surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.