H05K 2203/0703
Plating
H05K2203/0703 (Plating) appears on 1,877 US grants and 1,840 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,877
- Published applications
- 1,840
- Assignees
- 700
- Inventors
- 3,978
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 17 | 0 |
| 1977 | 11 | 0 |
| 1978 | 12 | 0 |
| 1979 | 5 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 16 | 0 |
| 1984 | 15 | 0 |
| 1985 | 19 | 0 |
| 1986 | 20 | 0 |
| 1987 | 26 | 0 |
| 1988 | 21 | 0 |
| 1989 | 19 | 0 |
| 1990 | 35 | 0 |
| 1991 | 42 | 0 |
| 1992 | 28 | 0 |
| 1993 | 41 | 0 |
| 1994 | 38 | 0 |
| 1995 | 32 | 0 |
| 1996 | 37 | 0 |
| 1997 | 23 | 0 |
| 1998 | 23 | 0 |
| 1999 | 40 | 0 |
| 2000 | 28 | 0 |
| 2001 | 32 | 24 |
| 2002 | 39 | 55 |
| 2003 | 47 | 57 |
| 2004 | 53 | 80 |
| 2005 | 42 | 78 |
| 2006 | 46 | 90 |
| 2007 | 58 | 88 |
| 2008 | 43 | 101 |
| 2009 | 50 | 95 |
| 2010 | 57 | 81 |
| 2011 | 71 | 74 |
| 2012 | 61 | 47 |
| 2013 | 62 | 45 |
| 2014 | 40 | 56 |
| 2015 | 35 | 69 |
| 2016 | 42 | 62 |
| 2017 | 56 | 59 |
| 2018 | 48 | 74 |
| 2019 | 67 | 88 |
| 2020 | 68 | 87 |
| 2021 | 52 | 64 |
| 2022 | 58 | 71 |
| 2023 | 55 | 68 |
| 2024 | 51 | 67 |
| 2025 | 41 | 45 |
| 2026 | 35 | 115 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0723ElectroplatingIndexing code808
- H05K 2203/0733Method for plating stud vias, i.e. massive vias formed by plating theIndexing code482
- H05K 2203/072Electroless platingIndexing code414
- H05K 2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structureIndexing code147
- H05K 2203/0709Catalytic ink or adhesive for electroless platingIndexing code87
- H05K 2203/0716Metallic plating catalystsIndexing code71
- H05K 2203/073Displacement plating, substitution plating or immersion platingIndexing code51
- H05K 2203/0713Plating poisonIndexing code27
All 9 subgroupsShow fewer
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Electrical contact arrangement for microfabricated ultrasonic transducer4 Aug 2026US 12,701,918 B2Bfly Operations, Inc.
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002