H05K 2203/073
Displacement plating, substitution plating or immersion plating
Official title: Displacement plating, substitution plating or immersion plating, e.g. for finish plating
H05K2203/073 (Displacement plating, substitution plating or immersion plating) appears on 51 US grants and 64 published applications in this corpus.
Search patents in H05K- Granted patents
- 51
- Published applications
- 64
- Assignees
- 54
- Inventors
- 178
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 2 |
| 2004 | 1 | 5 |
| 2005 | 2 | 3 |
| 2006 | 2 | 4 |
| 2007 | 3 | 3 |
| 2008 | 2 | 5 |
| 2009 | 1 | 6 |
| 2010 | 1 | 6 |
| 2011 | 1 | 3 |
| 2012 | 1 | 4 |
| 2013 | 3 | 2 |
| 2014 | 2 | 2 |
| 2015 | 2 | 7 |
| 2016 | 1 | 1 |
| 2017 | 5 | 1 |
| 2018 | 2 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 1 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board9 Dec 2025US 12,495,486 B2KYOCERA Corporation
- Electroless plating process25 Jun 2024US 12,018,378 B2Kojima Chemicals Co., Ltd.
- Method and apparatus for mounting and cooling a circuit component19 Sep 2023US 11,764,540 B2Landa Labs (2012) Ltd.
- Circuit board and method for manufacturing the same11 Feb 2020US 10,561,017 B1Avary Holding (Shenzhen) Co., Limited.
- Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device15 Oct 2019US 10,448,515 B2Atotech Deutschland GmbH
- Packaging substrate and manufacture method for the same25 Jun 2026US 2026/0182419 A1Absolics Inc.
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier and Method Manufacturing the Component Carrier25 Sep 2025US 2025/0301570 A1AT&S (Chongqing) Company Limited
- Circuit board13 Mar 2025US 2025/0089172 A1LG Innotek Co., Ltd.
- Metal wiring manufacturing method, transistor manufacturing method, and metal wiring16 May 2024US 2024/0164012 A1Nikon Corporation
Most cited
By later US patents
- Interconnect structure for joining a chip to a circuit card49US 6,121,069 AInternational Business Machines Corporation · 2000
- Adhesion of polymeric materials to metal surfaces41US 6,506,314 B1Atotech Deutschland GmbH · 2003
- Method for enhancing the solderability of a surface33US 5,733,599 AMacDermid, Incorporated · 1998
- Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection31US 5,953,623 AInternational Business Machines Corporation · 1999
- Tin and gold plating process29US 4,394,223 AThe United States of America as represented by the Secretary of the Air Force · 1983