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US 5,733,599 AGranted
Method for enhancing the solderability of a surface
AssigneeMacDermid, Incorporated
InventorsDonald Ferrier, Eric Yakobson
Life of this patent
Estimating the term…
Abstract
A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
Claims8
A process for enhancing the solderability of a surface, which process comprises:
- a). immersion plating a first metal, which is more noble than the surface, onto the surface;
- and thereafter
- b). immersion plating a second metal, which is more noble than the first metal, onto the first metal.
A process for immersion plating silver onto a metallic substrate wherein the substrate is contacted with a solution comprising:
- a). a soluble source of silver ions:
- b). an acid;
- c). optionally, an oxidant;
- d). an imidazole of the following formula:
- ##STR2## Wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are independently selected from the group consisting of substituted or unsubstituted alkyl groups, substituted or unsubstituted aryl groups, halogens, nitro groups and hydrogen.
2 more elements
Dependencies are inferred from the claim text.