H05K 2203/07
Treatments involving liquids
Official title: Treatments involving liquids, e.g. plating, rinsing
H05K2203/07 (Treatments involving liquids) appears on 3,328 US grants and 2,898 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,328
- Published applications
- 2,898
- Assignees
- 1,177
- Inventors
- 7,100
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 18 | 0 |
| 1978 | 25 | 0 |
| 1979 | 12 | 0 |
| 1980 | 21 | 0 |
| 1981 | 22 | 0 |
| 1982 | 16 | 0 |
| 1983 | 27 | 0 |
| 1984 | 31 | 0 |
| 1985 | 41 | 0 |
| 1986 | 44 | 0 |
| 1987 | 52 | 0 |
| 1988 | 48 | 0 |
| 1989 | 45 | 0 |
| 1990 | 68 | 0 |
| 1991 | 79 | 0 |
| 1992 | 71 | 0 |
| 1993 | 87 | 0 |
| 1994 | 73 | 0 |
| 1995 | 71 | 0 |
| 1996 | 76 | 0 |
| 1997 | 56 | 0 |
| 1998 | 70 | 0 |
| 1999 | 95 | 0 |
| 2000 | 77 | 0 |
| 2001 | 78 | 47 |
| 2002 | 87 | 103 |
| 2003 | 94 | 116 |
| 2004 | 95 | 141 |
| 2005 | 68 | 133 |
| 2006 | 67 | 137 |
| 2007 | 85 | 139 |
| 2008 | 59 | 155 |
| 2009 | 72 | 170 |
| 2010 | 93 | 141 |
| 2011 | 105 | 113 |
| 2012 | 99 | 81 |
| 2013 | 96 | 80 |
| 2014 | 62 | 89 |
| 2015 | 70 | 108 |
| 2016 | 69 | 97 |
| 2017 | 83 | 93 |
| 2018 | 89 | 121 |
| 2019 | 95 | 125 |
| 2020 | 94 | 135 |
| 2021 | 82 | 93 |
| 2022 | 83 | 96 |
| 2023 | 73 | 86 |
| 2024 | 72 | 100 |
| 2025 | 56 | 69 |
| 2026 | 50 | 130 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002