H05K 2203/0779
Characterised by the specific liquids involved
Official title: characterised by the specific liquids involved
H05K2203/0779 (Characterised by the specific liquids involved) appears on 805 US grants and 588 published applications in this corpus.
Search patents in H05K- Granted patents
- 805
- Published applications
- 588
- Assignees
- 426
- Inventors
- 2,139
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 3 | 0 |
| 1978 | 10 | 0 |
| 1979 | 4 | 0 |
| 1980 | 8 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 8 | 0 |
| 1984 | 9 | 0 |
| 1985 | 8 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 16 | 0 |
| 1989 | 15 | 0 |
| 1990 | 22 | 0 |
| 1991 | 27 | 0 |
| 1992 | 25 | 0 |
| 1993 | 31 | 0 |
| 1994 | 26 | 0 |
| 1995 | 23 | 0 |
| 1996 | 18 | 0 |
| 1997 | 19 | 0 |
| 1998 | 28 | 0 |
| 1999 | 30 | 0 |
| 2000 | 30 | 0 |
| 2001 | 23 | 14 |
| 2002 | 30 | 29 |
| 2003 | 33 | 35 |
| 2004 | 28 | 40 |
| 2005 | 15 | 36 |
| 2006 | 13 | 30 |
| 2007 | 13 | 22 |
| 2008 | 11 | 32 |
| 2009 | 10 | 34 |
| 2010 | 19 | 37 |
| 2011 | 12 | 18 |
| 2012 | 20 | 12 |
| 2013 | 15 | 18 |
| 2014 | 8 | 22 |
| 2015 | 18 | 20 |
| 2016 | 17 | 24 |
| 2017 | 14 | 17 |
| 2018 | 20 | 21 |
| 2019 | 11 | 20 |
| 2020 | 11 | 30 |
| 2021 | 17 | 14 |
| 2022 | 10 | 10 |
| 2023 | 9 | 9 |
| 2024 | 6 | 15 |
| 2025 | 9 | 19 |
| 2026 | 6 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures3 Mar 2026US 12,568,783 B2EKC Technology, Inc.
- Insulating circuit board and semiconductor device in which same is used24 Feb 2026US 12,563,665 B2Niterra Materials Co., Ltd.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Apparatus for dispensing material in a printer120US 5,947,022 ASpeedline Technologies, Inc. · 1999
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999