H05K 2203/0783
Using solvent
Official title: Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
H05K2203/0783 (Using solvent) appears on 299 US grants and 164 published applications in this corpus.
Search patents in H05K- Granted patents
- 299
- Published applications
- 164
- Assignees
- 189
- Inventors
- 763
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 8 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 17 | 0 |
| 1992 | 13 | 0 |
| 1993 | 12 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 13 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 6 | 7 |
| 2002 | 12 | 16 |
| 2003 | 16 | 13 |
| 2004 | 8 | 2 |
| 2005 | 2 | 11 |
| 2006 | 2 | 5 |
| 2007 | 5 | 8 |
| 2008 | 5 | 3 |
| 2009 | 2 | 9 |
| 2010 | 2 | 12 |
| 2011 | 5 | 10 |
| 2012 | 6 | 3 |
| 2013 | 5 | 5 |
| 2014 | 3 | 6 |
| 2015 | 4 | 3 |
| 2016 | 2 | 7 |
| 2017 | 7 | 6 |
| 2018 | 5 | 6 |
| 2019 | 2 | 5 |
| 2020 | 3 | 6 |
| 2021 | 4 | 5 |
| 2022 | 1 | 3 |
| 2023 | 3 | 1 |
| 2024 | 2 | 5 |
| 2025 | 1 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Electrical module and printed circuit board assembly comprising an electrical module27 Jan 2026US 12,538,425 B2Rolls-Royce Deutschland Ltd & Co KG
- Recyclable electronic device1 Jul 2025US 12,349,286 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Adhesive conductive paste26 Nov 2024US 12,152,169 B2Daicel Corporation
- Component carrier with low-solvent fiber-free dielectric layer16 Jul 2024US 12,041,730 B2AT&SAustria Technologie & Systemtechnik AG
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Conductive through vias and methods of forming conductive through vias11 Jun 2026US 2026/0164565 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Printing process assistance system7 May 2026US 2026/0124831 A1Yamaha Hatsudoki Kabushiki Kaisha
- Wiring-attached adhesive substrate, stacked device, glass stacked body, and manufacturing method of wiring-attached adhesive substrate15 May 2025US 2025/0159795 A1AGC Inc.
- Polymer-conductor matrix electrical interconnect8 May 2025US 2025/0151204 A1
Most cited
By later US patents
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Apparatus for dispensing material in a printer120US 5,947,022 ASpeedline Technologies, Inc. · 1999
- Nitrosation of homocysteine as a method for treating homocysteinemia86US 5,385,937 AThe Brigham and Women S Hospital, Inc. · 1995
- Method and apparatus to create electrical junctions for information routing in textile structures86US 7,299,964 B2Georgia Tech Research Corporation · 2007
- Method and apparatus for dispensing material in a printer72US 6,324,973 B2Speedline Technologies, Inc. · 2001