Recyclable electronic device

A method for recycling an electronic device,

• wherein the electronic device comprises:
• a stack comprising:
• a first substrate disposed at a first side of the stack,
• a set of electronics comprising a circuit with electronic components, and one or more delamination layers covering at least one side of the set of electronics;
• applying an encapsulation layer to a second side of the stack, opposite the first side, that encapsulates the one or more delamination layers between the applied encapsulation layer and the first substrate,
• wherein the one or more delamination layers separate the set of electronic components from the first substrate and/or the encapsulation layer;
• wherein at least one of the one or more delamination layers comprises a set of passages there through,
• wherein the encapsulation layer is applied in at least partially liquified form,
• wherein a first portion of the at least partially liquified encapsulation layer penetrates into the set of passages to directly contact the first substrate;
• wherein the encapsulation layer, including the first portion in the set of passages is solidified, and
• wherein the solidified first portion of the encapsulation layer in the set of passages forms a set of connections between a second portion of the encapsulation layer and the first substrate through the at least one delamination layer;
• and
• wherein the method comprises:
• injecting a fluid into the fluid inlet through the encapsulation layer to the one or more delamination layers in between the first substrate and the encapsulation layer;
• wherein the fluid injected into the fluid inlet forces the first substrate and encapsulation layer apart by a pressure of the injected fluid, and/or the injected fluid dissolves or disintegrates the one or more delamination layers;
• and
• wherein the set of interconnections between the encapsulation layer and the first substrate are broken and the set of electronics is exposed to the injected fluid, the set of electronics being released from at least one, preferably both, of the first substrate and the encapsulation layer for recycling one or more of the electronics components.