Component carrier with low-solvent fiber-free dielectric layer
AssigneeAT&SAustria Technologie & Systemtechnik AG
InventorsSeok Kim Tay, Mikael Tuominen, Kim Liu
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Abstract
A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.
Claims14
A method of manufacturing a plate-shaped component carrier, wherein the plate-shaped component carrier is configured as one of a group consisting of a printed circuit board, an IC substrate, and an interposer, the method comprising:
- forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the layer structures are provided in a plate form;
- reducing an amount of solvent in a fiber-free dielectric layer by pre-heating the fiber-free dielectric layer, which is directly connected to a metal layer, in such a way that the dielectric layer with a reduced amount of solvent remains at least partially uncured, and
- thereafter, in a separate manufacturing stage, laminating the fiber-free dielectric layer together with the metal layer to the stack by at least partially curing the dielectric layer.
Dependencies are inferred from the claim text.