Wiring-attached adhesive substrate, stacked device, glass stacked body, and manufacturing method of wiring-attached adhesive substrate

Abstract

To provide a wiring-attached adhesive substrate that can suppress the occurrence of crack and buckling in the wiring pattern formed on the adhesive layer. The wiring-attached adhesive substrate according to one aspect of the present disclosure comprises a substrate, an adhesive layer formed on the substrate, and a wiring pattern formed on the adhesive layer. The adhesive layer has an adhesive strength of 0.01 N/25 mm or more to a PET film, layer thickness variation when the adhesive layer is immersed in isopropyl alcohol for 1 minute is 20% or less, and layer thickness variation when the adhesive layer is immersed in toluene for 1 minute is 18% or less.

Dependencies are inferred from the claim text.