Conductive through vias and methods of forming conductive through vias

A method for fabricating a conductive through via in a circuit board, the method comprising:

• mixing copper formate with a solvent and forming a copper formate—solvent solution;
• adjusting a concentration of the copper formate—solvent solution and forming a refined copper formate—solvent solution;
• mixing the refined copper formate—solvent solution with metal particles and forming a metal particle—copper formate slurry;
• filling a via in a circuit board substrate with the metal particle—copper formate slurry;
• and
• low temperature sintering the metal particle—copper formate slurry in an oxygen-free environment and forming a large diameter conductive through via in the circuit board substrate.

A method for fabricating a conductive through via in a circuit board, the method comprising:

• mixing copper formate with a solvent and forming a copper formate—solvent solution;
• adjusting a concentration of the copper formate—solvent solution and forming a refined copper formate—solvent solution;
• mixing the refined copper formate—solvent solution with copper particles and forming a copper particle—copper formate slurry;
• filling a via in a circuit board substrate with the copper particle—copper formate slurry;
• and
• low temperature sintering the copper particle—copper formate slurry in an oxygen-free environment and forming a large diameter conductive through via in the circuit board substrate.