Adhesive for electroless plating, printed circuit boards and method of producing the same

A method of producing a printed circuit board, which comprises:

• (a) forming a cured adhesive layer on a substrate, with the forming including dispersing cured heat-resistant particles easily soluble in an oxidizing agent in a heat-resistant resin exhibiting a sparingly soluble property to said oxidizing agent, said cured heat-resistant particles being selected from the group consisting of a mixture of a heat-resistant resin particles having an average particle size of 2-10 .mu.m and heat-resistant resin fine particles having an average particle size of not more than 2 .mu.m, false particles obtained by adhering at least one of heat-resistant resin fine powder having an average particle size of not more than 2 .mu.m and inorganic fine powder having an average particle size of not more than 2 .mu.m to surfaces of heat-resistant particles having an average particle size of 2-10 .mu.m, and agglomerated particles obtained by agglomerating heat-resistant resin fine powder having an average particle size of not more than 2 .mu.m into an average particle size of 2-10 .mu.m, and mixtures thereof;
• (b) dissolving and removing heat-resistant particles existent on the surface portion of said adhesive layer with the use of an oxidizing agent whereby the surface portion is roughened;
• and
• (c) forming a conductor layer through electroless plating.