Insulating circuit board and semiconductor device in which same is used

An insulating circuit board, comprising:

• an insulating substrate made of a ceramic;
• and
• a copper member made of copper or a copper alloy, the copper member having a first surface and a second surface opposite to the first surface, the first surface being bonded to the insulating substrate via a bonding layer, the bonding layer including at least one selected from the group consisting of Ag, Cu, and Ti,
• in XPS analysis of a nitrogen amount at the second surface of the copper member, an average value of the nitrogen amount at any three locations being within a range of not less than 0 at % and not more than 50 at %,
• in XPS analysis of an oxygen amount at the second surface of the copper member, an average value of the oxygen amount at the three locations being within a range of not less than 0 at % and not more than 50 at %,
• in measurement of sulfate ions present at a surface of the insulating circuit board by ion chromatography, an amount of the sulfate ions being not less than 0 μg and not more than 5 μg per 40 cm2.

An insulating circuit board, comprising:

• an insulating substrate made of a ceramic;
• and
• a copper member made of copper or a copper alloy, the copper member having a first surface and a second surface opposite to the first surface, the first surface being bonded to the insulating substrate via a bonding layer, the bonding layer including at least one selected from the group consisting of Ag, Cu, and Ti,
• in XPS analysis of a nitrogen amount at the second surface of the copper member, an average value of the nitrogen amount at any three locations being within a range of not less than 0 at % and not more than 50 at %,
• in XPS analysis of an oxygen amount at the second surface of the copper member, an average value of the oxygen amount at the three locations being within a range of not less than 0) at % and not more than 50 at %, in measurement of fluorine ions present at a surface of the insulating circuit board by ion chromatography, an amount of the fluorine ions is not less than 0 μg and not more than 2 μg per 40 cm2.

An insulating circuit board, comprising:

• an insulating substrate;
• and
• a conductor part bonded to at least one surface of the insulating substrate,
• in XPS analysis of a nitrogen amount at a surface of the conductor part, an average value of the nitrogen amount at any three locations being within a range of not less than 0 at % and not more than 50 at %,
• wherein in measurement of chlorine ions present at a surface of the insulating circuit board by ion chromatography, an amount of the chlorine ions is not less than 0 μg and not more than 15 μg per 40 cm2.