H05K 2203/0756
Uses of liquids
Official title: Uses of liquids, e.g. rinsing, coating, dissolving
H05K2203/0756 (Uses of liquids) appears on 746 US grants and 489 published applications in this corpus.
Search patents in H05K- Granted patents
- 746
- Published applications
- 489
- Assignees
- 407
- Inventors
- 1,760
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 10 | 0 |
| 1981 | 12 | 0 |
| 1982 | 5 | 0 |
| 1983 | 8 | 0 |
| 1984 | 7 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 20 | 0 |
| 1988 | 16 | 0 |
| 1989 | 12 | 0 |
| 1990 | 17 | 0 |
| 1991 | 13 | 0 |
| 1992 | 22 | 0 |
| 1993 | 14 | 0 |
| 1994 | 19 | 0 |
| 1995 | 21 | 0 |
| 1996 | 26 | 0 |
| 1997 | 19 | 0 |
| 1998 | 29 | 0 |
| 1999 | 27 | 0 |
| 2000 | 24 | 0 |
| 2001 | 26 | 11 |
| 2002 | 18 | 19 |
| 2003 | 19 | 24 |
| 2004 | 17 | 21 |
| 2005 | 11 | 20 |
| 2006 | 8 | 17 |
| 2007 | 11 | 22 |
| 2008 | 8 | 18 |
| 2009 | 15 | 31 |
| 2010 | 11 | 21 |
| 2011 | 18 | 17 |
| 2012 | 16 | 20 |
| 2013 | 12 | 16 |
| 2014 | 17 | 9 |
| 2015 | 13 | 21 |
| 2016 | 12 | 18 |
| 2017 | 13 | 17 |
| 2018 | 22 | 32 |
| 2019 | 25 | 28 |
| 2020 | 16 | 27 |
| 2021 | 22 | 17 |
| 2022 | 18 | 14 |
| 2023 | 9 | 10 |
| 2024 | 9 | 18 |
| 2025 | 7 | 11 |
| 2026 | 6 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0759Forming a polymer layer by liquid coatingIndexing code240
- H05K 2203/0769Dissolving insulating materialsIndexing code226
- H05K 2203/0776Uses of liquids not otherwise provided for in h05k2203/0759 - h05k2203/0773Indexing code124
- H05K 2203/0773Dissolving the filler without dissolving the matrix materialIndexing code79
- H05K 2203/0763Treating individual holes or single row of holesIndexing code46
- H05K 2203/0766RinsingIndexing code37
Recent patents
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Circuit-forming method and circuit-forming apparatus28 Jul 2026US 12,696,397 B2Fuji Corporation
- Method for manufacturing ceramic circuit board30 Jun 2026US 12,667,900 B2Niterra Materials Co., Ltd.
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Method for applying a protective layer to a circuit-board assembly2 Jul 2026US 2026/0190247 A1Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987