H05K 2203/0759
Forming a polymer layer by liquid coating
Official title: Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
H05K2203/0759 (Forming a polymer layer by liquid coating) appears on 240 US grants and 202 published applications in this corpus.
Search patents in H05K- Granted patents
- 240
- Published applications
- 202
- Assignees
- 182
- Inventors
- 691
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 8 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 4 | 0 |
| 2001 | 11 | 5 |
| 2002 | 7 | 15 |
| 2003 | 8 | 10 |
| 2004 | 9 | 13 |
| 2005 | 4 | 10 |
| 2006 | 5 | 9 |
| 2007 | 4 | 9 |
| 2008 | 3 | 8 |
| 2009 | 4 | 13 |
| 2010 | 4 | 6 |
| 2011 | 6 | 5 |
| 2012 | 4 | 7 |
| 2013 | 3 | 5 |
| 2014 | 6 | 0 |
| 2015 | 2 | 5 |
| 2016 | 4 | 8 |
| 2017 | 3 | 4 |
| 2018 | 4 | 17 |
| 2019 | 10 | 10 |
| 2020 | 7 | 12 |
| 2021 | 10 | 6 |
| 2022 | 5 | 7 |
| 2023 | 5 | 5 |
| 2024 | 1 | 4 |
| 2025 | 1 | 5 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inkjet ink for printed circuit boards23 Sep 2025US 12,421,408 B2Agfa-Gevaert
- Motherboard with shockproof, shakeproof and waterproof functions, electronic device and waterproof preparation method27 Aug 2024US 12,075,562 B2Shenzhen Weibu Information Co., Ltd.
- Coatings and processing of transparent conductive films for stabilization of sparse metal conductive layers12 Dec 2023US 11,842,828 B2C3 Nano, Inc.
- Solder composition for use in solder joints of printed circuit boards28 Nov 2023US 11,832,386 B2Dell Products L. P.
- Circuit board4 Jul 2023US 11,696,408 B2Shinko Electric Industries Co., Ltd.
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Method for applying a protective layer to a circuit-board assembly2 Jul 2026US 2026/0190247 A1Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
- Method of producing structure, method of producing interior component, and method of producing electronic device9 Apr 2026US 2026/0101444 A1Alps Alpine Co., Ltd.
- Directing motion of droplets using differential wetting30 Oct 2025US 2025/0332591 A1Volta Labs, Inc.
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- High temperature polyimide film laminates and process for preparation thereof111US 4,543,295 AThe United States of America as represented by the director of the National Aeronautics and Space Administration · 1985
- Enhancement of polyimide adhesion on reactive metals96US 5,114,757 A1992
- Via formation for multilayer inductive devices and other devices82US 6,207,234 B1Vishay Vitramon Incorporated · 2001
- Method for joining conductive structures and an electrical conductive article81US 6,800,169 B2Fujitsu Limited · 2004