High temperature polyimide film laminates and process for preparation thereof
AssigneeThe United States of America as represented by the director of the National Aeronautics and Space Administration
InventorsAnne K. St. Clair, Terry L. St. Clair
Life of this patent
Estimating the term…
Abstract
High temperature polyimide film laminates and a process for fabricating large-area, void-free polyimide laminate structures wherein multiple-ply polyimide film laminates may be constructed without decreasing the individual film strength and wherein layers of metal foil may be laminated between polyimide film layers to yield a flexible high temperature resistant structure having capabilities for use as flexible electric circuits, in aerospace applications, and the like.
Claims42
A process for laminating high temperature resistant polyimide film comprising the steps of:
- providing at least two layers of a thin polyimide film;
- providing at least one layer of polyimide adhesive on one of said at least two layers of polyimide film;
- assembling said two layers of polyimide film to form a sandwich;
- said polyimide adhesive layer being a polyamic acid that is imidized to the polyimide state prior to assembling of the polyimide film sandwich;
- and
- subjecting the film-adhesive sandwich to heat and pressure to thermoplastically bond the sandwich into a void-free laminate structure.
A process for laminating high-temperature polyimide film and metal foil comprising the steps of:
- providing at least two layers of thin polyimide film;
- providing a metal foil layer between two layers of the polyimide film;
- providing a thermoplastic polyimide adhesive layer between each surface of the metal foil layer and the adjacent polyimide film layer;
- assembling the polyimide film, metal foil and adhesive so as to give film-adhesive-metal-adhesive-film sandwich;
- said polyimide adhesive layer being a polyamic acid that is imidized to remove its solvent and converted to the polyimide state prior to the step of assembling the sandwich;
- and
- subjecting the sandwich assembly to heat and pressure to thermally bond the sandwiched assembly into a void-free laminate structure.
A process for forming a laminate structure including the steps of:
- providing at least one layer of a thin polyimide film;
- providing at least one layer of a thin metal film;
- forming a layer of polyimide adhesive by forming a layer of polyamic acid and imidizing said layer of polyamic acid to form said layer of polyimide adhesive;
- positioning said layers of polyimide film and metal with said layer of polyimide adhesive therebetween;
- and
- bonding said layers of polyimide film and metal together under heat and pressure to form a substantially void-free laminate.
A laminate of high temperature resistant polyimide film comprising of:
- at least two layers of a thin polyimide film;
- and
- at least one layer of polyimide adhesive between said at least two layers of polyimide film;
- said two layers of polyimide film and said layer of adhesive forming a sandwich;
- said polyimide adhesive layer being a polyamic acid imidized to the polyimide state prior to assembling of the polyimide film sandwich;
- and
- said film-adhesive sandwich having been formed by heat and pressure to thermoplastically bond the sandwich into a void-free laminate structure.
A laminate of high-temperature polyimide film and metal foil comprising of:
- at least two layers of thin polyimide film;
- a metal foil layer between said two layers of polyimide film;
- a thermoplastic polyimide adhesive layer between each surface of the metal foil layer and the adjacent polyimide film layer;
- the polyimide film, metal foil and adhesive being assembled to form a film-adhesive-metal-adhesive-film sandwich;
- said polyimide adhesive layer being formed from a polyamic acid imidized to remove its solvent and converted to the polyimide state prior to being assembled in the sandwich;
- and
- said sandwich assembly being bonded together under heat and pressure to form a void-free laminate structure.
A laminate of polyimide film and metal including:
- at least one layer of a thin polyimide film;
- at least on layer of a thin metallic film;
- and
- a layer of polyimide adhesive between said layer of polyimide film and said layer of metallic film;
- said layers having been bonded together by heat and pressure to form a substantially void-free laminate, and said layer of polyimide adhesive having been formed by imidizing a layer of polyamic acid prior to bonding said layers together.
Dependencies are inferred from the claim text.