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US 11,832,386 B2Granted
Solder composition for use in solder joints of printed circuit boards
AssigneeDell Products L.P.
InventorDeeder M. Aurongzeb
Life of this patent
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Abstract
A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.
Claims11
A solder composition for use in solder joints of printed circuit boards (PCBs), comprising:
- a compound layer comprising an alloy of bismuth, tin, and indium;
- and
- a graphene coating positioned on the compound layer,
- wherein the alloy comprises up to approximately 70% tin, up to approximately 29% bismuth, and up to approximately 1% indium.
1 more element
A printed circuit board, including:
- a first surface including a via connected to one or more traces;
- a solder ball joint formed on the via, the solder ball joint formed from a solder composition including:
- a compound layer comprising an alloy of bismuth, tin, and indium;
- and
- a graphene coating positioned on the compound layer,
- wherein the alloy comprises up to approximately 70% tin, up to approximately 29% bismuth, and up to approximately 1% indium.
3 more elements
A method of depositing a solder joint composition on a printed circuit board (PCB), comprising:
- depositing an alloy comprising bismuth, tin, and indium on the PCB to form a compound layer;
- melting the alloy to form a solder ball joint on the PCB;
- and
- coating the compound layer with graphene,
- wherein the alloy comprises up to approximately 70% tin, up to approximately 29% bismuth, and up to approximately 1% indium.
2 more elements
Dependencies are inferred from the claim text.