H05K 2203/0769
Dissolving insulating materials
Official title: Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
H05K2203/0769 (Dissolving insulating materials) appears on 226 US grants and 93 published applications in this corpus.
Search patents in H05K- Granted patents
- 226
- Published applications
- 93
- Assignees
- 131
- Inventors
- 443
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 13 | 0 |
| 1995 | 8 | 0 |
| 1996 | 15 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 4 | 3 |
| 2002 | 4 | 1 |
| 2003 | 4 | 10 |
| 2004 | 5 | 4 |
| 2005 | 4 | 6 |
| 2006 | 2 | 4 |
| 2007 | 4 | 5 |
| 2008 | 2 | 3 |
| 2009 | 7 | 3 |
| 2010 | 0 | 3 |
| 2011 | 2 | 1 |
| 2012 | 4 | 2 |
| 2013 | 4 | 4 |
| 2014 | 2 | 6 |
| 2015 | 4 | 4 |
| 2016 | 3 | 7 |
| 2017 | 6 | 6 |
| 2018 | 7 | 6 |
| 2019 | 4 | 3 |
| 2020 | 4 | 3 |
| 2021 | 3 | 3 |
| 2022 | 3 | 1 |
| 2023 | 0 | 0 |
| 2024 | 2 | 2 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
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- Method of making high density solder bumps and a substrate socket for high density solder bumps149US 5,024,372 AMotorola, Inc. · 1991
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996