H05K 2203/0766
Rinsing
Official title: Rinsing, e.g. after cleaning or polishing a conductive pattern
H05K2203/0766 (Rinsing) appears on 37 US grants and 31 published applications in this corpus.
Search patents in H05K- Granted patents
- 37
- Published applications
- 31
- Assignees
- 41
- Inventors
- 131
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 1 |
| 2014 | 1 | 1 |
| 2015 | 0 | 4 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 2 | 2 |
| 2019 | 2 | 2 |
| 2020 | 0 | 2 |
| 2021 | 3 | 1 |
| 2022 | 2 | 3 |
| 2023 | 2 | 2 |
| 2024 | 3 | 5 |
| 2025 | 1 | 0 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing ceramic circuit board30 Jun 2026US 12,667,900 B2Niterra Materials Co., Ltd.
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Electronic device31 Mar 2026US 12,593,402 B2Beijing Dream Ink Technologies Co., Ltd.
- Substrates having adhesion promotor layers and related methods30 Dec 2025US 12,512,397 B2Intel Corporation
- Method for improving the colour difference of LED display screen2 Jul 2024US 12,027,504 B2Huizhou China Eagle Electronic Technology Co., Ltd.
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Electronic device and manufacturing method thereof18 Jul 2024US 2024/0244745 A1Beijing Dream Ink Technologies Co., Ltd.
- Surface tension driven flexible electronics transfer printing method27 Jun 2024US 2024/0215152 A1Dalian University of Technology
- Modified copper surface, heteroaromatic silane compounds and their usage for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation30 May 2024US 2024/0179851 A1Atotech Deutschland GmbH
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method11 Apr 2024US 2024/0117280 A1Tokyo Ohka Kogyo.Co., Ltd.
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Nitrosation of homocysteine as a method for treating homocysteinemia86US 5,385,937 AThe Brigham and Women S Hospital, Inc. · 1995
- Method for treatment fluid application and removal30US 3,935,041 AChemcut Corporation · 1976
- Pre-plate cleaning process30US 5,077,176 AAT&T Bell Laboratories · 1991
- Rinsing processes and equipment21US 7,364,625 B2FSI International, Inc. · 2008