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US 2024/0117280 A1Published application
Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsIvan Ryzhii, Mai Sugawara, Yugeng Wu
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Abstract
A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term of a Hansen solubility parameter from a polar term of the Hansen solubility parameter.
Claims7
A metal residue removing liquid, comprising:
- a mixed solvent (S0) that contains a first organic solvent (S1) and a second organic solvent (S2);
- a salt (F) of a base containing no metal ions and hydrofluoric acid;
- and
- water,
- wherein the first organic solvent (S1) is diethylformamide, and
- the mixed solvent (S0) has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term (δH) of a Hansen solubility parameter from a polar term (δP) of a Hansen solubility parameter.
3 more elements
Dependencies are inferred from the claim text.