H05K 2203/0773
Dissolving the filler without dissolving the matrix material
Official title: Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
H05K2203/0773 (Dissolving the filler without dissolving the matrix material) appears on 79 US grants and 39 published applications in this corpus.
Search patents in H05K- Granted patents
- 79
- Published applications
- 39
- Assignees
- 34
- Inventors
- 154
- Latest grant
- 25 Jan 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 2 |
| 2002 | 4 | 1 |
| 2003 | 4 | 2 |
| 2004 | 2 | 2 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 0 | 3 |
| 2010 | 2 | 1 |
| 2011 | 2 | 6 |
| 2012 | 4 | 3 |
| 2013 | 1 | 3 |
| 2014 | 5 | 2 |
| 2015 | 2 | 3 |
| 2016 | 2 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Electrohydrodynamic printing of nanomaterials for flexible and stretchable electronics25 Jan 2022US 11,230,134 B2North Carolina State University
- Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers27 Mar 2018US 9,929,097 B2Intel Corporation
- Conductive film with networked nano-material4 Oct 2016US 9,462,681 B2LG Electronics Inc.
- Resin composition for solder bump formation, solder bump formation method, and member having solder bumps16 Aug 2016US 9,415,469 B2San-Ei Kagaku Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing wiring board25 Aug 2015US 9,119,319 B2Shinko Electric Industries Co., Ltd.
- Process for producing an interconnect device for electronic and/or mechatronic components and interconnect device28 Nov 2024US 2024/0397630 A1
- Electrohydrodynamic printing of nanomaterials for flexible and stretchable electronics20 Aug 2020US 2020/0262230 A1North Carolina State University
- Method for applying an electrical microstructure, elastomer structure, fiber composite component, and tire27 Feb 2020US 2020/0068718 A1Gottfried Wilhelm Leibniz Universitat Hannover
- Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers17 Mar 2016US 2016/0079174 A1Intel Corporation
- Wiring board, semiconductor device, and method for manufacturing wiring board16 Apr 2015US 2015/0102510 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991
- Multilayer printed wiring board and method of manufacturing multilayer printed wiring board90US 6,828,510 B1Ibiden Co., Ltd. · 2004
- Multilayer print circuit board having a blind hole in an insulation layer with a roughened surface formed by application of an oxidizing agent and method of production61US 6,127,633 AVictor Company of Japan, Ltd. · 2000
- Multilayered printed circuit board and manufacturing method thereof56US 8,148,643 B2Ibiden Co., Ltd. · 2012
- Plating method and method for producing a multi-layered printed wiring board using the same53US 5,517,758 AMatsushita Electric Industrial Co., Ltd. · 1996