Method for applying an electrical microstructure, elastomer structure, fiber composite component, and tire
AssigneeGottfried Wilhelm Leibniz Universitat Hannover
InventorsHans Jürgen MAIER, Marc Christopher WURZ, Sebastian BENGSCH
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Abstract
The invention relates to a method for applying an electrical microstructure on or in an object of any type, wherein the electrical microstructure is first applied to a flexible film and the film is fastened, with the electrical microstructure applied thereto in front, to a fastening surface of the object by adhesive bonding and/or vulcanization attachment. The invention further relates to an elastomer structure, to a fiber composite component, and to a motor-vehicle tire, each having at least one electrical microstructure fastened thereto by adhesive bonding and/or vulcanization attachment.
Claims15
A method for applying an electrical microstructure on or in an object, comprising:
- applying the electrical microstructure on a flexible film to form a combination of the film with the electrical microstructure applied thereon;
- and
- fastening the combination of the film with the electrical microstructure applied thereon on a fastening surface of the object by one or more of adhesive bonding on the object, and vulcanizing in the object.
An elastomer structure having at least one electrical microstructure adhesively bonded thereon or vulcanized in.
A fiber composite component having at least one electrical microstructure adhesively bonded thereon.
A tire having an electrical microstructure adhesively bonded or vulcanized in on the tire inner side or embedded between different layers of the tire.
Dependencies are inferred from the claim text.