Process for producing an interconnect device for electronic and/or mechatronic components and interconnect device
OwnerFriedrich PROESinventor
Life of this patent
Estimating the term…
Loading patent…
OwnerFriedrich PROESinventor
Estimating the term…
The invention relates to a method for manufacturing a circuit carrier (1) for electronic and/or mechatronic components, a circuit carrier for electronic and/or mechatronic components and a circuit. In particular, the invention relates to a method for producing a circuit carrier (1) for electronic and/or mechatronic components, comprising the steps of producing a base body (2) using an additive manufacturing method, the base body (2) having or consisting of a plastic material (8) with metal particles (10), applying a smoothing means which dissolves the plastic material (8) to a base body surface (3) of the base body (2) so that the base body surface (3) is substantially free of metal particles (10), and producing at least one conductor path (12, 18) on the base body surface (3).
Method of manufacturing a circuit carrier for electronic and/or mechatronic components, comprising the steps:
Dependencies are inferred from the claim text.