Back to results
US 2016/0079174 A1Published application
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
AssigneeIntel Corporation
InventorsRavi Nalla, Omar Bchir, Houssam Jomaa
Life of this patent
Estimating the term…
Abstract
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
Claims1
An apparatus comprising:
- a substrate build-up film, wherein the build-up film comprises:
- an epoxy material;
- and
- a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured and an exterior formed from the same material as the interior, is more cured than the interior.
1 more element
Dependencies are inferred from the claim text.