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US 9,929,097 B2Granted
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
AssigneeIntel Corporation
InventorsRavi Nalla, Omar Bchir, Houssam Jomaa
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Abstract
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
Claims9
An assembly, comprising:
- a die;
- an IC package substrate, including:
- one or more organic dielectric layers, wherein at least one dielectric layer has a plurality of cavities located at a surface of the dielectric layer, the plurality of cavities having a substantially circular cross-section;
- wherein the at least one dielectric layer further includes a distribution of spheres within the dielectric layer that include a resin interior that is less than fully cured, and are less etch resistant than a dielectric material surrounding the spheres;
- and
- a metallization layer coupled to the one or more dielectric layers.
3 more elements
Dependencies are inferred from the claim text.