H05K 2203/0723
Electroplating
Official title: Electroplating, e.g. finish plating
H05K2203/0723 (Electroplating) appears on 808 US grants and 796 published applications in this corpus.
Search patents in H05K- Granted patents
- 808
- Published applications
- 796
- Assignees
- 350
- Inventors
- 1,730
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 8 | 0 |
| 1984 | 9 | 0 |
| 1985 | 14 | 0 |
| 1986 | 8 | 0 |
| 1987 | 13 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 13 | 0 |
| 1991 | 19 | 0 |
| 1992 | 14 | 0 |
| 1993 | 14 | 0 |
| 1994 | 18 | 0 |
| 1995 | 14 | 0 |
| 1996 | 19 | 0 |
| 1997 | 16 | 0 |
| 1998 | 15 | 0 |
| 1999 | 18 | 0 |
| 2000 | 17 | 0 |
| 2001 | 16 | 10 |
| 2002 | 16 | 19 |
| 2003 | 17 | 19 |
| 2004 | 13 | 24 |
| 2005 | 12 | 20 |
| 2006 | 17 | 30 |
| 2007 | 19 | 18 |
| 2008 | 10 | 10 |
| 2009 | 6 | 32 |
| 2010 | 15 | 25 |
| 2011 | 15 | 23 |
| 2012 | 17 | 15 |
| 2013 | 20 | 7 |
| 2014 | 10 | 22 |
| 2015 | 8 | 26 |
| 2016 | 11 | 23 |
| 2017 | 20 | 18 |
| 2018 | 12 | 40 |
| 2019 | 34 | 49 |
| 2020 | 36 | 46 |
| 2021 | 36 | 40 |
| 2022 | 31 | 49 |
| 2023 | 41 | 51 |
| 2024 | 40 | 51 |
| 2025 | 30 | 27 |
| 2026 | 29 | 102 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Electroless nickel polyalloys269US 4,397,812 ARichardson Chemical Company · 1983
- Electrolessly plated product having a polymetallic catalytic film underlayer266US 4,632,857 ARichardson Chemical Company · 1986
- Method of preparing substrate surface for electroless plating and products produced thereby260US 4,232,060 ARichardson Chemical Company · 1980
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997