H05K 2203/0713
Plating poison
Official title: Plating poison, e.g. for selective plating or for preventing plating on resist
H05K2203/0713 (Plating poison) appears on 27 US grants and 35 published applications in this corpus.
Search patents in H05K- Granted patents
- 27
- Published applications
- 35
- Assignees
- 21
- Inventors
- 75
- Latest grant
- 6 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 3 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 4 |
| 2015 | 1 | 2 |
| 2016 | 1 | 3 |
| 2017 | 2 | 0 |
| 2018 | 2 | 6 |
| 2019 | 4 | 3 |
| 2020 | 2 | 3 |
| 2021 | 1 | 4 |
| 2022 | 2 | 2 |
| 2023 | 3 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers6 May 2025US 12,295,108 B2AT&SAustria Technologie & Systemtechnik AG
- Method for manufacturing wiring board, and wiring board2 Jul 2024US 12,028,989 B2Toyota Jidosha Kabushiki Kaisha
- Method for manufacturing wiring board10 Oct 2023US 11,785,721 B2Toyota Jidosha Kabushiki Kaisha
- Simultaneous and selective wide gap partitioning of via structures using plating resist19 Sep 2023US 11,765,827 B2Sanmina Corporation
- Method for manufacturing wiring board30 May 2023US 11,665,829 B2Toyota Jidosha Kabushiki Kaisha
- Method of Plating a Printed Circuit Board17 Jul 2025US 2025/0234462 A1Agfa-Gevaert
- Component Carrier With Partially Metallized Hole Using Anti-Plating Dielectric Structure and Electroless Plateable Separation Barriers20 Apr 2023US 2023/0119480 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing wiring board, and wiring board22 Sep 2022US 2022/0304162 A1Toyota Jidosha Kabushiki Kaisha
- Method for manufacturing wiring board25 Aug 2022US 2022/0272847 A1Toyota Jidosha Kabushiki Kaisha
- Three dimensional circuit formation4 Nov 2021US 2021/0345498 A1Averatek Corporation
Most cited
By later US patents
- Method for production of printed circuits by electroless metal plating17US 4,293,592 AHitachi, Ltd. · 1981
- Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material15US 4,151,313 AHitachi, Ltd. · 1979
- Local electroless plating process for plastics10US 4,940,608 AOkuno Chemical Industry Co., Ltd. · 1990
- Simultaneous and selective wide gap partitioning of via structures using plating resist9US 9,781,830 B2Sanmina Corporation · 2017
- Photoresist-free metal deposition8US 7,947,163 B2Novellus Systems, Inc. · 2011