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US 12,295,108 B2Granted
Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers
AssigneeAT&SAustria Technologie & Systemtechnik AG
InventorJiangfeng Zhou
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal;
- wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier,
- wherein the second hole portion extends upwardly from the anti-plating dielectric structure up to an upper main surface of the stack.
2 more elements
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming a hole in the stack with a first hole portion covered with metal and with a second hole portion not covered with metal;
- defining the second hole portion by an anti-plating dielectric structure and an electroless plateable separation barrier;
- and
- wherein the second hole portion extends from the anti-plating dielectric structure to a main surface of the stack.
2 more elements
A method, comprising:
- providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal;
- wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier, the second hole portion extending from the anti-plating dielectric structure to a main surface of the stack;
- and
- using the component carrier for conducting a signal having a frequency greater than or equal to 100 MHz.
3 more elements
Dependencies are inferred from the claim text.