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US 2023/0119480 A1Published application
Component Carrier With Partially Metallized Hole Using Anti-Plating Dielectric Structure and Electroless Plateable Separation Barriers
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorJiangfeng ZHOU
Life of this patent
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal;
- wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.
1 more element
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming a hole in the stack with a first hole portion covered with metal and with a second hole portion not covered with metal;
- and
- defining the second hole portion by an anti-plating dielectric structure and an electroless plateable separation barrier.
1 more element
A method, comprising:
- providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal;
- wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier;
- and
- using the component carrier for a high-frequency application where high-frequency includes a frequency greater than or equal to 100 MHz.
3 more elements
Dependencies are inferred from the claim text.