Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material

Abstract

Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of: (I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate, (II) removing the initiator from the surface of said resist, and (III) dipping the insulating substrate in an electroless metal plating solution, thereby forming an electroless metal plating on a positive pattern of circuit, wherein a thermosetting resin containing a rutile type solid solution of metal oxides of titanium, nickel and antimony is employed as the masking material in said step (I), and the initiator is removed from the surface of the resist through contact with a hydrochloric acid solution of ammonium persulfate in said step (II).

Dependencies are inferred from the claim text.