H05K 2203/0733
Method for plating stud vias, i.e. massive vias formed by plating the
Official title: Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
H05K2203/0733 (Method for plating stud vias, i.e. massive vias formed by plating the) appears on 482 US grants and 454 published applications in this corpus.
Search patents in H05K- Granted patents
- 482
- Published applications
- 454
- Assignees
- 193
- Inventors
- 918
- Latest grant
- 10 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 9 | 0 |
| 1994 | 5 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 10 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 13 |
| 2002 | 16 | 26 |
| 2003 | 24 | 27 |
| 2004 | 27 | 30 |
| 2005 | 21 | 28 |
| 2006 | 18 | 36 |
| 2007 | 23 | 43 |
| 2008 | 16 | 63 |
| 2009 | 26 | 37 |
| 2010 | 35 | 28 |
| 2011 | 42 | 32 |
| 2012 | 27 | 13 |
| 2013 | 24 | 14 |
| 2014 | 15 | 10 |
| 2015 | 12 | 11 |
| 2016 | 12 | 7 |
| 2017 | 9 | 9 |
| 2018 | 11 | 8 |
| 2019 | 7 | 7 |
| 2020 | 7 | 4 |
| 2021 | 3 | 0 |
| 2022 | 3 | 3 |
| 2023 | 1 | 3 |
| 2024 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
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- Interconnection substrate and method of manufacturing such a substrate14 Sep 2023US 2023/0290712 A1STMicroelectronics (Grenoble 2) SAS
- Flexible Printed Circuit Board (FPCB) and Method for Manufacturing the Same10 Aug 2023US 2023/0253174 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991
- Semiconductor device and method for manufacturing substrate of the same147US 6,351,031 B1Fujitsu Limited · 2002