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US 2023/0253174 A1Published application
Flexible Printed Circuit Board (FPCB) and Method for Manufacturing the Same
AssigneeLG Energy Solution, Ltd.
InventorSang Ok Seon
Life of this patent
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Abstract
A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.
Claims20
A flexible printed circuit board (FPCB) comprising:
- a pattern circuit layer, wherein the pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse comprises:
- a first conductive metal;
- and
- a second conductive metal wire,
- wherein the first conductive metal wire and the second conductive metal wire have are arranged in a double helix structure.
2 more elements
A method for manufacturing an FPCB, the method comprising:
- forming a first lower conductive wire and a second lower conductive wire on a top surface of a base film;
- exposing both ends of the first lower conductive wire and the second lower conductive wire;
- laminating a micro-pillar on the top surface of the base film;
- forming a first via conductive wire and a second via conductive wire on both the ends of the first lower conductive wire and the second lower conductive wire, respectively;
- injecting a filler into an empty space in which the micro-pillar is not filled on the top surface of the base film;
- and
- forming a first upper conductive wire connecting the first via conductive wires to each other and a second upper conductive wire connecting the second via conductive wires to each other on a top surface of the micro-pillar.
4 more elements
Dependencies are inferred from the claim text.