Circuit board and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorChun-Hung Kuo
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Abstract
The present disclosure provides a circuit board and its manufacturing method. The circuit board includes a first circuit layer, a first conductive post, and a second circuit layer. The first circuit layer includes a first pad and a first seed layer covering a sidewall of the first pad. The first conductive post is on the first pad and directly connected to the first pad. The second circuit layer includes a second pad and a second seed layer covering a sidewall of the second pad. The second pad is on a first connecting end of the first conductive post. The first connecting end is embedded in the second pad, and the second pad is connected to and directly contacts the first connecting end. The first seed layer and the second seed layer do not extend on a sidewall of the first conductive post.
Claims11
A circuit board, comprising:
- a first circuit layer, comprising at least one first pad and a first seed layer covering a sidewall of the first pad;
- a first conductive post on the first pad and directly connected to the first pad, wherein the first pad and the first conductive post are integrally formed into one piece;
- and
- a second circuit layer comprising at least one second pad and a second seed layer covering a sidewall of the second pad, wherein the second pad is on a first connecting end of the first conductive post, the first connecting end is embedded in the second pad, and the second pad is connected to and directly contacts the first connecting end,
- wherein the first seed layer and the second seed layer do not extend on a sidewall of the first conductive post, and
- wherein the second seed layer comprises a first bottom portion contacting the first conductive post and a side portion covering the sidewall of the second pad, and a thickness of the first bottom portion is thinner than a thickness of the side portion.
Dependencies are inferred from the claim text.