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US 11,393,762 B2Granted
Formation of tall metal pillars using multiple photoresist layers
AssigneeIntel Corporation
InventorsSri Chaitra J. Chavali, Liwei Cheng, Siddharth K. Alur, Sheng Li
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Abstract
An apparatus system is provided which comprises: a substrate; a metal pillar formed on the substrate, the metal pillar comprising a first section and a second section, wherein the first section of the metal pillar is formed by depositing metal in a first opening of a first photoresist layer, and wherein the second section of the metal pillar is formed by depositing metal in a second opening of a second photoresist layer.
Claims19
A method comprising:
- forming a first dry film resist layer on a substrate;
- patterning the first dry film resist layer to form a first opening in the first dry film resist layer, wherein the first opening exposes a surface of the substrate;
- forming, prior to forming a metal in the first opening, a second dry film resist layer on the first dry film resist layer and over the first opening in the first dry film resist layer, wherein the first opening comprises an unfilled opening between the exposed surface of the substrate and a bottom surface of the second dry film resist layer;
- patterning the second dry film resist layer to form a second opening in the second dry film resist layer, wherein the second opening is aligned over the first opening;
- depositing a metal on the exposed surface, in the first opening and in the second opening to form a metal pillar;
- and
- removing the first dry film resist layer and the second dry film resist layer.
4 more elements
A method comprising:
- forming a first dry film resist layer on a substrate;
- patterning the first dry film resist layer to form a first opening in the first dry film resist layer, wherein the first opening exposes a surface of the substrate;
- forming a second dry film resist layer on the first dry film resist layer and over the first opening in the first dry film resist layer, wherein the first opening is between the surface of the substrate and a bottom surface of the second dry film resist layer;
- patterning the second dry film resist layer to form a second opening in the second dry film resist layer, wherein the second opening is aligned over the first opening;
- forming, prior to depositing a metal, a third dry film resist layer on the second dry film resist layer and over the second opening in the second dry film resist layer, wherein the first and second openings are between the surface of the substrate and a bottom surface of the third dry film resist film;
- patterning the third dry film resist layer to form a third opening in the third dry film resist layer, wherein the third opening is aligned over the first and second openings;
- depositing a metal in the first opening, the second opening, and the third opening to form a metal pillar;
- and
- removing the first dry film resist layer, the second dry film resist layer, and the third dry film resist layer, wherein removing the first dry film resist layer, the second dry film resist layer, and the third dry film resist layer comprises at least one of peeling, treating with chemicals and/or heat, or exposure to a laser.
6 more elements
A method comprising:
- forming a first dry film resist layer on a substrate;
- patterning the first dry film resist layer to form a first opening in the first dry film resist layer, wherein the first opening exposes a surface of the substrate;
- forming a second dry film resist layer on the first dry film resist layer and over the first opening in the first dry film resist layer, wherein the first opening is between the surface of the substrate and a bottom surface of the second dry film resist layer;
- patterning the second dry film resist layer to form a second opening in the second dry film resist layer, wherein the second opening is aligned over the first opening;
- forming, prior to depositing a metal in the first or second openings, a third dry film resist layer on the second dry film resist layer and over the second opening in the second dry film resist layer, wherein the first and second openings are between the surface of the substrate and a bottom surface of the third dry film resist film;
- patterning the third dry film resist layer to form a third opening in the third dry film resist layer, wherein the third opening is aligned over the first and second openings;
- depositing a metal in the first opening, the second opening, and the third opening to form a metal pillar;
- and
- removing the first, second, and third dry film resist layers.
6 more elements
Dependencies are inferred from the claim text.