Printed circuit board and electronic component package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorChan Hoon Ko
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a substrate including an external connection pad; and a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad. The metal post may include a first post portion, elongated while having a substantially constant width, a second post portion extending to the outside of the substrate in the thickness direction of the substrate while having a narrow width, and a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion while having substantially the same width as the first post portion. The third post portion may forma lower end portion of the metal post.
Claims23
A printed circuit board comprising:
- a substrate including an external connection pad;
- and
- a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad,
- wherein:
- the metal post includes:
- a first post portion,
- a second post portion extending to the outside of the substrate in the thickness direction of the substrate, and
- a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion,
- the third post portion provides a lowest end portion of the metal post,
- the second post portion has a width narrower than the first post portion and the third post portion, and
- at least a portion of the second post portion is exposed from the first post portion.
A printed circuit board comprising:
- a substrate in which insulating layers and wiring patterns are stacked;
- an external connection pad disposed on an outermost layer of the substrate;
- a solder resist layer partially shielding the external connection pad;
- and
- a metal post extending outwardly from the solder resist layer in a thickness direction of the substrate,
- wherein:
- the metal post includes a contact post portion disposed on the solder resist layer, a first post portion extending on the solder resist layer and having a width greater than that of the contact post portion, a second post portion having a narrower width than the first post portion, and a third post portion extending from the second post portion and having a wider width than the second post portion,
- the second post portion is arranged between the first post portion and the third post portion in the thickness direction, and
- at least a portion of the second post portion is exposed from the first post portion.
An electronic component package comprising:
- a first substrate in which insulating layers and wiring patterns are stacked and including a first external connection pad disposed on an outermost layer of the first substrate and a solder resist layer partially shielding the first external connection pad;
- a metal post extending to the outside of the first substrate in a thickness direction of the first substrate from the first external connection pad;
- a second substrate having a second external connection pad connected to the metal post;
- and
- a semiconductor chip mounted on at least one of the first substrate or the second substrate,
- wherein:
- the metal post includes a contact post portion disposed on the solder resist layer, a first post portion extending on the solder resist layer and having a width greater than that of the contact post portion, a second post portion having a narrower width than the first post portion, and a third post portion extending from the second post portion and having a wider width than the second post portion,
- the second post portion is arranged between the first post portion and the third post portion in the thickness direction, and
- at least a portion of the second post portion is covered by an insulating material.
A printed circuit board comprising:
- a substrate including a connection pad thereon and a wiring pattern therein;
- an insulating layer disposed on the substrate and including an opening exposing a portion of the connection pad;
- and
- a metal post connected to the connection pad and protruding from the substrate,
- wherein:
- the metal post includes a groove portion on a side surface of the metal post and spaced apart from the insulating layer,
- at least a portion of the groove portion is exposed from a portion of the metal post, and
- the connection pad and the metal post overlap each other along a thickness direction of the substrate.
Dependencies are inferred from the claim text.