H05K 2203/072
Electroless plating
Official title: Electroless plating, e.g. finish plating or initial plating
H05K2203/072 (Electroless plating) appears on 414 US grants and 464 published applications in this corpus.
Search patents in H05K- Granted patents
- 414
- Published applications
- 464
- Assignees
- 235
- Inventors
- 1,247
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 8 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 1 |
| 2002 | 7 | 5 |
| 2003 | 4 | 9 |
| 2004 | 12 | 15 |
| 2005 | 7 | 22 |
| 2006 | 5 | 16 |
| 2007 | 14 | 21 |
| 2008 | 15 | 21 |
| 2009 | 12 | 15 |
| 2010 | 6 | 16 |
| 2011 | 9 | 11 |
| 2012 | 13 | 6 |
| 2013 | 9 | 15 |
| 2014 | 6 | 12 |
| 2015 | 9 | 19 |
| 2016 | 6 | 17 |
| 2017 | 16 | 18 |
| 2018 | 18 | 24 |
| 2019 | 24 | 35 |
| 2020 | 27 | 34 |
| 2021 | 15 | 20 |
| 2022 | 22 | 26 |
| 2023 | 16 | 31 |
| 2024 | 16 | 23 |
| 2025 | 21 | 18 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Wiring substrate and method for manufacturing the same23 Jun 2026US 12,666,540 B2Ibiden Co., Ltd.
- Composition for depositing a palladium coating on a substrate16 Jun 2026US 12,655,525 B2Atotech Deutschland GmbH
- Base material for printed circuit, printed circuit, and method of manufacturing base material for printed circuit28 Apr 2026US 12,611,845 B2Sumitomo Electric Industries, Ltd.
- Wiring substrate28 Apr 2026US 12,615,712 B2Shinko Electric Industries Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
- Fabricating electronic devices with metallized internal structures using 3d printing and microfluidic electroless plating27 Aug 2026US 2026/0255484 A1Atomic Semi Inc.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board9 Jul 2026US 2026/0197948 A1Sanmina Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994