H05K 2203/0716
Metallic plating catalysts
Official title: Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
H05K2203/0716 (Metallic plating catalysts) appears on 71 US grants and 68 published applications in this corpus.
Search patents in H05K- Granted patents
- 71
- Published applications
- 68
- Assignees
- 54
- Inventors
- 219
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 1 | 3 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 1 | 1 |
| 2012 | 0 | 2 |
| 2013 | 1 | 2 |
| 2014 | 1 | 2 |
| 2015 | 2 | 4 |
| 2016 | 3 | 4 |
| 2017 | 2 | 3 |
| 2018 | 1 | 3 |
| 2019 | 2 | 4 |
| 2020 | 4 | 9 |
| 2021 | 3 | 7 |
| 2022 | 3 | 7 |
| 2023 | 5 | 5 |
| 2024 | 7 | 1 |
| 2025 | 4 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Printed wiring board9 Dec 2025US 12,495,489 B2Ibiden Co., Ltd.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper4 Mar 2025US 12,245,383 B2Atotech Deutschland GmbH
- Method of manufacture for embedded IC chip directly connected to PCB28 Jan 2025US 12,213,258 B2Averatek Corporation
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for producing a circuit board structure24 Apr 2025US 2025/0133665 A1Tripod (Wuxi) Electronic Co., Ltd.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper10 Oct 2024US 2024/0341042 A1Atotech Deutschland GmbH
- Laminated film structure and method for manufacturing laminated film structure30 Nov 2023US 2023/0389189 A1Panasonic Intellectual Property Management Co., Ltd.
- Printed wiring board5 Oct 2023US 2023/0319987 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Direct electroplating of through holes56US 4,969,979 AInternational Business Machines Corporation · 1990
- Method to manufacture a flexible cable for a disk drive52US 8,702,998 B1Western Digital Technologies, Inc. · 2014
- Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating46US 4,790,912 ATechno-Instruments Investments Ltd. · 1988