Method for producing a circuit board structure

A method for producing a circuit board structure, comprising:

• an ink layer forming process implemented by forming at least one ink layer on at least one of two side surfaces of a core substrate;
• a laminating process implemented by laminating two inner substrates onto the two side surfaces of the core substrate opposite to each other;
• a thru-hole forming process implemented by forming a thru-hole that penetrates through the two inner substrates, the at least one ink layer, and the core substrate;
• an activating process implemented by forming an activation layer in the thru-hole covering an inner side wall of the thru-hole and the at least one ink layer;
• an ink removing process implemented by removing the at least one ink layer and a plurality of portions of the activation layer covering the at least one ink layer in the thru-hole;
• and
• a plating process implemented by performing a plating operation to replace the activation layer that remains on the inner side wall of the thru-hole with a plating layer to form a circuit board structure.