H05K 2203/0709
Catalytic ink or adhesive for electroless plating
H05K2203/0709 (Catalytic ink or adhesive for electroless plating) appears on 87 US grants and 136 published applications in this corpus.
Search patents in H05K- Granted patents
- 87
- Published applications
- 136
- Assignees
- 89
- Inventors
- 318
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 5 |
| 2005 | 1 | 7 |
| 2006 | 2 | 5 |
| 2007 | 3 | 5 |
| 2008 | 2 | 5 |
| 2009 | 1 | 4 |
| 2010 | 2 | 9 |
| 2011 | 2 | 4 |
| 2012 | 5 | 9 |
| 2013 | 4 | 6 |
| 2014 | 5 | 8 |
| 2015 | 3 | 12 |
| 2016 | 10 | 12 |
| 2017 | 5 | 10 |
| 2018 | 8 | 5 |
| 2019 | 5 | 5 |
| 2020 | 4 | 8 |
| 2021 | 3 | 5 |
| 2022 | 2 | 2 |
| 2023 | 0 | 0 |
| 2024 | 4 | 3 |
| 2025 | 0 | 6 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Plasma treatments for flexures of hard disk drives29 Oct 2024US 12,129,567 B2Hutchinson Technology Incorporated
- Four dimensional printed circuit boards1 Oct 2024US 12,108,539 B2The Government of the United States of America, as represented by the Secretary of the Navy
- Catalyzed metal foil and uses thereof to produce electrical circuits13 Aug 2024US 12,063,748 B2Averatek Corporation
- Catalyzed metal foil and uses thereof16 Jan 2024US 11,877,404 B2Averatek Corporation
- Method of producing printed circuit board and method of forming electro-conductive underlayer17 Apr 2025US 2025/0126721 A1Elephantech Inc.
- Method of making transparent composite articles30 Jan 2025US 2025/0033327 A1Eastman Kodak Company
- Transparent composite article with electrically-conductive pattern30 Jan 2025US 2025/0034345 A1Eastman Kodak Company
- Article with electrically-conductive pattern30 Jan 2025US 2025/0037900 A1Eastman Kodak Company
- Method to make thin film electrically-conductive pattern30 Jan 2025US 2025/0040055 A1Eastman Kodak Company
Most cited
By later US patents
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987
- Method for patterned metallization of a substrate surface75US 5,576,073 ALPKF CAD/CAM Systeme GmbH · 1996
- Radio frequency identification device and method48US 6,867,983 B2Avery Dennison Corporation · 2005
- Flexible circuit chemistry39US 8,110,254 B1SRI International · 2012