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US 8,110,254 B1Granted
Flexible circuit chemistry
AssigneeSRI International
InventorsSunity Sharma, Jaspreet Singh Dhau
Life of this patent
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Abstract
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Claims14
A method for producing active palladium on a substrate, the method comprising:
- depositing a palladium precursor solution onto the substrate, wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine;
- exposing the palladium precursor solution to conditions that promote evaporation of solvent from the palladium precursor solution to leave a palladium precursor on the substrate;
- and
- decomposing the palladium precursor on the substrate to produce a pattern of active palladium, wherein the active palladium is monatomically disposed on the substrate in the form of single isolated atoms.
1 more element
Dependencies are inferred from the claim text.