Catalyst ink for plating and electroless plating method using same
AssigneeKorea Electrotechnology Research Institute
InventorsSeung Kwon Seol, Sang Hyeon Lee, Won Suk Chang, Jae Yeon Pyo
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Abstract
A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.
Claims8
A method for plating, comprising:
- applying a catalyst ink to a substrate to form a precursor pattern;
- and
- forming a plated pattern by immersing the substrate in which the precursor pattern is formed in a plating solution which is maintained at a temperature equal to or higher than a lower critical solution temperature in a temperature-composition phase diagram for a solvent-polymer binary system for electroless plating,
- wherein, the catalyst ink comprising:
- a polymer binder;
- a metal ion as a catalyst;
- a coupling agent for coupling the metal ion and the polymer;
- and
- a solvent,
- wherein the polymer has the lower critical solution temperature in the temperature-composition phase diagram for the solvent-polymer binary system,
- wherein the lower critical solution temperature is 55° C. or higher.
A method for plating, comprising:
- applying a catalyst ink to a substrate to form a precursor pattern;
- and
- forming a plated pattern by immersing the substrate in which the precursor pattern is formed in a plating solution which is maintained at a temperature equal to or higher than a lower critical solution temperature in a temperature-composition phase diagram for a solvent-polymer binary system for electroless plating,
- wherein, the catalyst ink comprising:
- a polymer binder;
- a metal ion as a catalyst;
- a coupling agent for coupling the metal ion and the polymer;
- and
- a solvent,
- wherein the polymer has the lower critical solution temperature in the temperature-composition phase diagram for the solvent-polymer binary system,
- wherein the lower critical solution temperature is 50° C. or higher, and
- wherein the polymer comprises an OH functional group.
A method for plating, comprising:
- applying a catalyst ink to a substrate to form a precursor pattern;
- and
- forming a plated pattern by immersing the substrate in which the precursor pattern is formed in a plating solution which is maintained at a temperature equal to or higher than a lower critical solution temperature in a temperature-composition phase diagram for a solvent-polymer binary system for electroless plating,
- wherein, the catalyst ink comprising:
- a polymer binder;
- a metal ion as a catalyst;
- a coupling agent for coupling the metal ion and the polymer;
- and
- a solvent,
- wherein the polymer has the lower critical solution temperature in the temperature-composition phase diagram for the solvent-polymer binary system,
- wherein the lower critical solution temperature is 50° C. or higher, and
- wherein the polymer comprises at least one selected from the group consisting of hydroxypropyl cellulose, methyl cellulose, hydroxypropylmethyl cellulose, ethyl(hydroxyethyl)cellulose, poly(N-isopropylacrylamide-co-acrylic acid) and poly(propylene glycol).
Dependencies are inferred from the claim text.