H05K 2203/0726
Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
H05K2203/0726 (Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure) appears on 147 US grants and 58 published applications in this corpus.
Search patents in H05K- Granted patents
- 147
- Published applications
- 58
- Assignees
- 83
- Inventors
- 308
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 7 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 13 | 0 |
| 1992 | 4 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 5 |
| 2003 | 3 | 1 |
| 2004 | 2 | 3 |
| 2005 | 1 | 5 |
| 2006 | 2 | 5 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 4 | 3 |
| 2010 | 1 | 0 |
| 2011 | 2 | 2 |
| 2012 | 0 | 0 |
| 2013 | 2 | 3 |
| 2014 | 0 | 2 |
| 2015 | 2 | 2 |
| 2016 | 1 | 5 |
| 2017 | 1 | 3 |
| 2018 | 3 | 5 |
| 2019 | 5 | 2 |
| 2020 | 1 | 2 |
| 2021 | 0 | 1 |
| 2022 | 4 | 2 |
| 2023 | 2 | 0 |
| 2024 | 1 | 3 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical contact arrangement for microfabricated ultrasonic transducer4 Aug 2026US 12,701,918 B2Bfly Operations, Inc.
- Solder paste stencil with aperture wall coating20 Aug 2024US 12,069,810 B2SanDisk Technologies LLC
- Electrical contact arrangement for microfabricated ultrasonic transducer6 Jun 2023US 11,672,179 B2Bfly Operations, Inc.
- Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern30 May 2023US 11,665,828 B2Samwon Act Co., Ltd.
- Apparatus for electro-forming and apparatus for horizontal electro-forming20 Dec 2022US 11,530,489 B2LG Display Co., Ltd.
- Low-loss flat-cable signal line for ultra-high frequency, flexible printed circuit board using the same, and flexible printed circuit board continuous-manufacturing device30 Oct 2025US 2025/0338392 A1Samwon Act Co., Ltd.
- Wiring board29 Aug 2024US 2024/0292533 A1KYOCERA Corporation
- Electrical contact arrangement for microfabricated ultrasonic transducer11 Apr 2024US 2024/0122073 A1Bfly Operations, Inc.
- Method for producing wiring circuit board28 Mar 2024US 2024/0107667 A1Nitto Denko Corporation
- Solder paste stencil with aperture wall coating19 May 2022US 2022/0159842 A1Western Digital Technologies, Inc.
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Flexible electrical interconnect and method of making137US 4,991,290 AMicroelectronics and Computer Technology Corporation · 1991
- Electrical connections with shaped contacts103US 5,354,205 AHughes Aircraft Company · 1994
- Process for manufacturing panels to be used in microelectronic systems82US 4,404,059 A1983
- Method for making noble metal conductive leads for suspension assemblies81US 7,388,733 B2Hutchinson Technology Incorporated · 2008