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US 12,069,810 B2Granted
Solder paste stencil with aperture wall coating
AssigneeSanDisk Technologies LLC
InventorsFakhrozi Bin Che Ani, Mohamad Riduwan Bin Ramli, Mohamad Solehin Bin Mohamed Sunar, Ibrahym Bin Ahmad
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Abstract
A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.
Claims20
A surface mount technology (SMT) solder paste stencil, comprising:
- a substrate defining a plurality of solder apertures, each aperture wall of each of the plurality of solder apertures is coated with a coating material that enhances a smoothness of the each aperture wall in a SMT process and reduces wetting of a solder paste relative to the each aperture wall,
- wherein the coating material has a first water contact angle greater than a second water contact angle of the substrate without the coating material,
- wherein the coating material is a silicone material,
- wherein the first water contact angle is greater than thirty-nine degrees and less than one hundred and ten degrees, and
- wherein second water contact angle is thirty-nine degrees or less.
2 more elements
A method for manufacturing a surface mount technology (SMT) solder paste stencil, the method comprising:
- cutting a substrate to define a plurality of solder apertures;
- and
- depositing a coating material on each aperture wall of each of the plurality of solder apertures, the coating material enhances a smoothness of the each aperture wall in a SMT process and reduces wetting of a solder paste relative to the each aperture wall, wherein the coating material has a first water contact angle greater than a second water contact angle of the substrate without the coating material,
- wherein the coating material is a silicone material,
- wherein the first water contact angle is greater than thirty-nine degrees and less than one hundred and ten degrees, and
- wherein the second water contact angle is thirty-nine degrees or less.
3 more elements
A method for performing surface-mount soldering, the method comprising:
- applying solder material to a substrate defining a plurality of solder apertures, each aperture wall of each of the plurality of solder apertures is coated with a coating material that enhances a smoothness of the each aperture wall in a surface mount technology (SMT) process and reduces wetting of a solder paste relative to the each aperture wall, wherein the coating material has a first water contact angle greater than a second water contact angle of the substrate without the coating material;
- and
- depositing, with the substrate, the solder material onto a printed circuit board,
- wherein the coating material is a silicone material,
- wherein the first water contact angle is greater than thirty-nine degrees and less than one hundred and ten degrees, and
- wherein the second water contact angle is thirty-nine degrees or less.
3 more elements
Dependencies are inferred from the claim text.