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US 2022/0159842 A1Published application
Solder paste stencil with aperture wall coating
AssigneeWestern Digital Technologies, Inc.
InventorsFakhrozi Bin Che Ani, Mohamad Riduwan Bin Ramli, Mohamad Solehin Bin Mohamed Sunar, Ibrahym Bin Ahmad
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Abstract
A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.
Claims20
A solder paste stencil, comprising:
- a substrate defining a plurality of solder apertures, each aperture wall of each of the plurality of solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the each aperture wall.
A method for manufacturing a solder paste stencil, the method comprising:
- cutting a substrate to define a plurality of solder apertures;
- and
- depositing a coating material on each aperture wall of each of the plurality of solder apertures, the coating material reduces wetting of a solder paste relative to the each aperture wall.
A method for performing surface-mount soldering, the method comprising:
- applying solder material to a substrate defining a plurality of solder apertures, each aperture wall of each of the plurality of solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the each aperture wall;
- and
- depositing, with the substrate, the solder material onto a printed circuit board.
Dependencies are inferred from the claim text.