Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern

A method for manufacturing an FCCL (Flexible Copper Clad Laminate), the method comprising:

• forming a conductive pattern, having a first metal layer made of a first metal, on a mold for electroforming through electroforming;
• transferring the conductive pattern, having the first metal layer made of the first metal, from the mold for electroforming to the bottom of a polymer plastic film;
• forming a conductive pattern with a two-layer alloy structure constituted by the first metal layer made of the first metal and a second metal layer made of a second metal, by plating the bottom of the first metal layer made of the first metal with the second metal;
• and
• forming a conductive pattern with a three-layer alloy structure, constituted by the first metal layer made of the first metal, the second metal layer made of the second metal, and a third metal layer made of a third metal, by additionally plating the bottom of the second metal layer made of the second metal with the third metal layer made of the third metal, wherein the third metal serves to add stiffness, and is one of Ni, Co, Cr, Fe, W and Ti,
• wherein the first metal is Cu, and the second metal serves to add flexibility and is one of Sn, Au, Ag and Al,
• wherein the FCCL is capable of controlling the flexibility and stiffness of the conductive pattern, and
• wherein a composition of an alloy material including the first metal, the second metal and the third metal is controlled by a composition of electrolytes corresponding to the first metal, the second metal for adding flexibility, and the third metal for adding stiffness, thereby controlling the flexibility and stiffness of the conductive pattern.

A method for manufacturing an FCCL (Flexible Copper Clad Laminate), the method comprising:

• forming a conductive pattern, having a first metal layer made of a first metal, on a mold for electroforming through electroforming;
• transferring the conductive pattern, having the first metal layer made of the first metal, from the mold for electroforming to the bottom of a polymer plastic film;
• and
• forming a conductive pattern with a two-layer alloy structure, constituted by the first metal layer made of the first metal and a binary alloy layer of a second metal and a third metal, by plating the bottom of the first metal layer made of the first metal with a binary alloy made of the second metal and the third metal,
• wherein the first metal is Cu, the second metal serves to add flexibility and is one of Sn, Au, Ag and Al, and the third metal serves to add stiffness and is one of Ni, Co, Cr, Fe, W and Ti,
• wherein the FCCL is capable of controlling the flexibility and stiffness of the conductive pattern, and
• wherein a composition of an alloy material including the first metal, the second metal and the third metal is controlled by a composition of electrolytes corresponding to the first metal, the second metal for adding flexibility, and the third metal for adding stiffness, thereby controlling the flexibility and stiffness of the conductive pattern.

A method for manufacturing an FCCL (Flexible Copper Clad Laminate), the method comprising:

• forming a conductive pattern with a binary alloy layer on a mold for electroforming by plating the mold with a binary alloy of a first metal and a second metal through electroforming;
• transferring the conductive pattern having the binary alloy layer from the mold for electroforming to the bottom of a polymer plastic film;
• and
• forming a conductive pattern with a two-layer structure, constituted by the binary alloy layer and a third metal layer made of a third metal, by plating the bottom of the binary alloy layer with the third metal layer made of the third metal,
• wherein the first metal is Cu, the second metal serves to add flexibility and is one of Sn, Au, Ag and Al, and the third metal serves to add stiffness and is one of Ni, Co, Cr, Fe, W and Ti,
• wherein the FCCL is capable of controlling the flexibility and stiffness of the conductive pattern, and
• wherein a composition of an alloy material including the first metal, the second metal and the third metal is controlled by a composition of electrolytes corresponding to the first metal, the second metal for adding flexibility, and the third metal for adding stiffness, thereby controlling the flexibility and stiffness of the conductive pattern.