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US 11,672,179 B2Granted
Electrical contact arrangement for microfabricated ultrasonic transducer
AssigneeBfly Operations, Inc.
InventorsJonathan M. Rothberg, Susan A. Alie, Jaime Scott Zahorian, Paul Francis Cristman, Keith G. Fife
Life of this patent
Estimating the term…
Abstract
An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
Claims28
An apparatus, comprising:
- an ultrasound-on-a-chip device having a plurality of ultrasonic transducer cells including first and second ultrasonic transducer cells corresponding to respective first and second cavities of a plurality of cavities of the ultrasound-on-a-chip device;
- and
- for each of the first and second ultrasonic transducer cells of the plurality of ultrasonic transducer cells, multiple conductive connections disposed between a first layer of the ultrasound-on-a-chip device and an integrated circuit, the first layer being between the plurality of cavities and the integrated circuit.
Dependencies are inferred from the claim text.