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US 2024/0292533 A1Published application
Wiring board
AssigneeKYOCERA Corporation
InventorHidetoshi YUGAWA
Life of this patent
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Abstract
A wiring board according to the present disclosure includes an insulation layer, and a wiring conductor positioned on the insulation layer. The wiring conductor includes a phosphorus-containing electroless copper-plating layer positioned on the insulation layer, a nickel-containing electroless copper-plating layer positioned on the phosphorus-containing electroless copper-plating layer, and an electrolytic copper-plating layer positioned on the nickel-containing electroless copper-plating layer.
Claims6
A wiring board comprising:
- an insulation layer;
- and
- a wiring conductor positioned on the insulation layer,
- wherein the wiring conductor comprises
- a phosphorus-containing electroless copper-plating layer positioned on the insulation layer;
- a nickel-containing electroless copper-plating layer positioned on the phosphorus-containing electroless copper-plating layer;
- and
- an electrolytic copper-plating layer positioned on the nickel-containing electroless copper-plating layer.
5 more elements
Dependencies are inferred from the claim text.